Kore Electronics

We can support a variety of market sectors including Automotive navigation systems, Computing devices, Agricultural automation systems, Consumer audio electronics, to Commercial Dispensing devices.
Assemblies Capabilities

● SMT/Through Hole Techoligies
● BGA
● HLA/Box Build/System
● Configure-to-Order (CTO)
● Build-to-Order (BTO)
● Direct Order Fulfillment (DOF)
● Component Integration
● Conformal Coating and Potting
● Complex Cable and Harness
● RoHS Compliance

Component Technology

0.4mm Pitch QFP
Flip Chip – Up to 18mm x 35mm x 0.1 mm die
BGA – > 1500 I/O
CBGA – > 800 I/O
CCGA – > 1500 I/O
PGA – > 591 I/O
Chip Scale Package (CSP), to 0.4mm Pitch
Passive Discrete – 0101
Optical Actives and Passives

 

Testing

● In-circuit Test (analogue and digital)
● MDA or more comprehensive incorporating Boundary Scan, Test Jet and Q-test
● Automated functional test ATE
● Interfacing to simulated and real loads.
● Combinational test
● Manual functional test
● Simulation and real time testing
● RF Test and diagnostics
● Flying Probe MDA testing
● X-Ray inspection
● Automatic Optical Inspection